Award-winning on-device AI chipmaker will pursue key industry partnerships to bolster this expansion; following a strong showing at ISC West, it will continue this momentum at Secutech Taipei, Embedded Vision Summit, and COMPUTEX 2024. TAIPEI and SEOUL, South Korea, April 23, 2024 /PRNewswire/ — DEEPX, an on-device AI semiconductor company, is announcing plans to expand […]
With the new dart M with GigE interface, the leading international manufacturer of high-quality cameras and matching image processing hardware and software enables its customers to assemble board level cameras according to the modular principle. Ahrensburg, April 23, 2024 – Basler AG presents the dart M , a customizable, cost-efficient, board level camera with GigE
dart M: Basler Presents Modular, Board Level Camera Read More +
GRENOBLE, France, April 23, 2024 (GLOBE NEWSWIRE) — Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company and global innovator of imaging solutions, is pleased to announce a new technology and design collaboration with Airy3D (Montreal, Canada), a leading 3D vision solution provider. The first result of this partnership is the co-engineering of the recently announced
Airy3D and Teledyne e2v Collaboration Delivers More Affordable 3D Vision Solutions Read More +
Enables longer battery runtime in wearables, trackers, and activity monitoring Geneva, Switzerland, April 18, 2024 – The LSM6DSV32X 6-axis inertial module (IMU) from STMicroelectronics has a large accelerometer full-scale range of 32g and 4000 degrees-per-second (dps) gyroscope to measure intensive movements and impacts, including freefall height estimation. Ready to drive future generations of edge-AI applications,
Hala Point, the industry’s first 1.15 billion neuron neuromorphic system, builds a path toward more efficient and scalable AI. What’s New: Today, Intel announced that it has built the world’s largest neuromorphic system. Code-named Hala Point, this large-scale neuromorphic system, initially deployed at Sandia National Laboratories, utilizes Intel’s Loihi 2 processor, aims at supporting research for future brain-inspired artificial
Intel Builds World’s Largest Neuromorphic System to Enable More Sustainable AI Read More +
AMD Ryzen™ PRO 8040 Series and AMD Ryzen™ PRO 8000 Series provide businesses with the most advanced x86 processors1 for AI PCs SANTA CLARA, Calif., April 16, 2024 (GLOBE NEWSWIRE) — Today, AMD (NASDAQ: AMD) announced new products that will expand its commercial mobile and desktop AI PC portfolio, delivering exceptional productivity and premium AI
Innovative technology enhances AI-enabled intelligent edge solutions and increases neural networking capabilities CHANDLER, Ariz., April 15, 2024 — Microchip Technology (Nasdaq: MCHP) has acquired Neuronix AI Labs to expand its capabilities for power-efficient, AI-enabled edge solutions deployed on field programmable gate arrays (FPGAs). Neuronix AI Labs provides neural network sparsity optimization technology that enables a
Microchip Technology Acquires Neuronix AI Labs Read More +
April 11 2024 – Las Vegas, Nev. – Visidon was recognized by the Security Industry Association (SIA) as an awardee at the 2024 SIA New Products and Solutions (NPS) Awards, the flagship awards program presented in partnership with ISC West recognizing innovative security products, services and solutions. In video surveillance advanced imaging technologies, Visidon was selected
Visidon Wins SIA NPS Video Surveillance Advanced Imaging Technologies Award Read More +
15th of April 2024 – FRAMOS, a leading global expert in vision systems dedicated to innovation and excellence in enabling devices to see and think, is pleased to announce its presence at the Automate Show 2024 in Chicago, Illinois, USA. FRAMOS will be joining more than 800 game-changing exhibitors at the Automate Show from May
Micron’s automotive memory and storage enable central compute, digital cockpit and advanced driver-assistance systems for Qualcomm customers NUREMBERG, Germany, April 10, 2024 (GLOBE NEWSWIRE) — Embedded World — Micron Technology, Inc. (Nasdaq: MU), today announced that it has qualified a full suite of its automotive-grade memory and storage solutions for Qualcomm Technologies Inc.’s Snapdragon® Digital Chassis™,
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